Special 11 ICITA, 2014

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Pb-Free Solder Ball Robustness Comparison under AC and TC Reliability Test

Tan Cai Hui, Yap Boon Kar, Tan Chou Yong, Koh Wen Shi

1-5

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Optimization of Wafer Singulation Process on Copper/Low-k Materials for
Semiconductor Device Assembly

Koh Wen Shi, Yap Boon Kar, Halina Misran, Yow Kai Yun, Lo Wei Yew and Tan Cai Hui

6-11

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Marangoni Boundary Layer Flow in Micropolar Fluid

Siti Hidayah Muhad Saleh, Norihan Md Arifin, Roslinda Mohd Nazar, Fadzilah Md Ali and Ioan Pop

12-23

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Characterization of Laser Micromachining Process for Low-k / Ultra Low-k
Semiconductor Device

Koh Wen Shi, Yap Boon Kar, Halina Misran, Yow Kai Yun, Lau Teck Beng and Lo Wai Yew

24-30

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8D Methodology: An Effective Approach for Problem Solving in Automotive Assembly Line

Wan Ahmad Najmuddin Wan Saidin, Azalan Mohamed Ibrahim, Mohd Zaidi Azir, Harlina Ngah,
Noraishah Mohamad Noor and M.H Norhidayah

31-34

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A Reactive Navigation for a Mobile Robot: An Improvement for Modified Virtual Semi
Circle Approach

S. Amira, R. N. Farah, N. Irwan, R.L. Zuraida and M.H. Hafiz

35-39

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An Application of Statistical Quality Control On Process Improvement: Case Study

M.H. Norhidayah and Wan Ahmad Najmuddin Wan Saidin

40-43

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Optimization on Conveyor System Performance using Overall Equipment Effectiveness

Abdul Talib Bon and Anuar Mohamad Nor

44-48

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